AUSTIN, Texas, Nov. 17 /PRNewswire-FirstCall/ -- SC08 -- LSI Corporation
(NYSE: LSI) today introduced its new Engenio(R) DE6900 high-density SATA drive
enclosure and 8Gb/s Fibre Channel (8GFC) host connectivity as enhancements to
its flagship LSI(TM) Engenio 7900 HPC storage system. Designed for
compute-intensive applications and high-bandwidth workloads, the 7900 HPC
storage system combines leading-edge performance with enterprise-class
availability and reliability features for applications requiring continuous
high-speed data accessibility.
"The amount of cooled, raised floor available at commercial and
government-sponsored, high-performance data centers is at a premium," said
Steve Hochberg, senior director, HPC segment, LSI. "When combined with the
low-cost, high-density SATA drive enclosure and 8Gb/s Fibre Channel
connections, the 7900 HPC storage system provides organizations with dramatic
savings on power consumption and floor space while continuing to provide high
performance for data-intensive applications."
High-density enclosure improves energy efficiency by 30 percent
Based on sixth-generation LSI(TM) architecture, the Engenio DE6900
high-density SATA drive enclosure enhances the 7900 HPC system's ability to
handle the massive data requirements of high-performance computing (HPC)
applications. The DE6900 is a 4U, 19-inch rack-mountable drive enclosure
capable of housing a total of sixty 3.5-inch low-cost, high-capacity SATA
drives for a maximum capacity of 60TB in a single enclosure.
The new enclosure offers a 2.8X density increase compared to the current
sixteen-drive Fibre Channel (FC) enclosure, enabling more drives per unit of
rack space and scaling capacity to 480 SATA drives within the same footprint.
The increased density translates into more than 30 percent savings on power
consumption and greater than 65 percent savings on floor space to achieve
similar performance and capacity. High-efficiency power supplies and
variable-speed cooling fans further reduce power consumption.
"Escalating floor space requirements and rising energy costs are among the
top concerns of high-performance computing customers today," said Ian Miller,
senior vice president of Sales and Marketing at Cray Inc. "The new
high-density enclosure from LSI allows the 7900 HPC system to directly address
these concerns. We look forward to delivering the solution to our customers."
Serviceability and data availability are enhanced with easy access
front-load drive trays and dampeners for controlled drawer movement --
avoiding I/O degradation from acceleration and deceleration of drives. All
drives are active when drawers are open allowing individual drives to be
replaced without impacting the operation of other drives. Safety is also
enhanced by the reduction of forward-hanging mass during service operations.
"For many years, Silicon Graphics and LSI have worked hand-in-glove to
provide HPC customers with a family of tightly-integrated, highly efficient,
high-performance storage solutions," said Kurt Kuckein, SGI(R) InfiniteStorage
product line manager. "With today's announcements, we're able to offer our
customers a high-density storage solution on our flagship mixed workload
storage system, the InfiniteStorage 4600, increasing scalability while
simultaneously lowering power consumption."
Maximize storage performance with 8GFC host connectivity
The 7900 HPC is one of the industry's first storage systems to offer 8GFC
host connectivity. The sixteen 8GFC host interfaces enable organizations to
consolidate, simplify and lower the cost of SAN infrastructure by decreasing
the number of host and switch ports required to deliver equivalent or
increased performance.
With the addition of 8GFC to the existing field-replaceable host interface
options, including 4GFC and 20Gb/s InfiniBand(R) interfaces, the 7900 HPC
storage system is designed to quickly and easily adapt to evolving
infrastructure, application and capacity requirements. Users can mix host
interfaces, RAID levels (0, 1, 3, 5, 6 and 10) and disk drives within a single
system -- optimizing price/performance and future proofing existing FC SAN
investments.
The Engenio 7900 HPC storage system is available today through select OEM
partners. The system will be on display in the LSI booth # 344 at the
Supercomputing '08 (SC08) conference, which takes place November 15-21 at the
Austin Convention Center.
Additional information on the 7900 HPC system is available at
http://www.lsi.com/7900hpc/.
About LSI
LSI Corporation (NYSE: LSI) is a leading provider of innovative silicon,
systems and software technologies that enable products, which seamlessly bring
people, information and digital content together. The company offers a broad
portfolio of capabilities and services including custom and standard product
ICs, adapters, systems and software that are trusted by the world's best known
brands to power leading solutions in the Storage and Networking markets. More
information is available at http://www.lsi.com.
Editor's Notes:
1. All LSI news releases (financial, acquisitions, manufacturing,
products, technology, etc.) are issued exclusively by PR Newswire and are
immediately thereafter posted on the company's external website,
http://www.lsi.com.
2. LSI, the LSI logo design and Engenio are trademarks or registered
trademarks of LSI Corporation.
3. Cray is a registered trademark of Cray, Inc. InfiniBand is a registered
trademark of System I/O, Inc. SGI is a registered trademark of SGI in the
United States and/or other countries worldwide. All other brand or product
names may be trademarks or registered trademarks of their respective
companies.
