TAIPEI, Taiwan, Feb. 23 /PRNewswire-Asia-FirstCall/ -- Advanced
Semiconductor Engineering, Inc. (NYSE: ASX; TAIEX: 2311, "ASE" or the
"Company") and Advanced Microelectronic Products, Inc. (TAIEX: 6287, "AMPI")
announced today the signing of a memorandum of understanding (MOU), indicating
their intent to enter into a strategic alliance focused on providing
semiconductor manufacturing turnkey services for customers in the MOSFET,
power IC, and discrete markets.
Further intent of this strategic relationship is to provide seamless
manufacturing services to turnkey customers through the alignment of ASE and
AMPI's IT infrastructures and systems, co-development of process and product
related technologies, as well as joint marketing programs. In addition, both
parties are committed to the future cooperation in and collaboration on
continuous quality improvement, and enhanced support and services.
"Forming this strategic alliance with AMPI strengthens ASE's position
while expanding our footprint in the MOSFET, power IC, and discrete markets,"
said Dr. Tien Wu, chief operating officer, ASE Group. "ASE has significantly
escalated our discrete manufacturing capabilities, and this MOU with AMPI
accentuates our solid commitment to customers seeking a complete turnkey
service, as well as faster time-to-market."
"We're excited to form a strategic partnership with ASE, the world's
largest provider of independent semiconductor manufacturing services in
assembly and testing. Working closely together, this MOU will enable both
companies to offer extremely competitive integrated power semiconductor
manufacturing services in terms of cost, time to market, cycle time, and
technology," said Dr. Hong Yuan Chen, president, AMPI. "AMPI has recently
become a Hong Hai Group invested company and formed strategic alliance with
Advanced Power Electronics Corp (APEC). Hong Hai is the world's largest
Electronics Manufacturing Service (EMS) provider, and APEC is Taiwan's leading
power MOSFET design house. This further alliance with ASE marks an important
milestone for AMPI, as it marks the completion of our vertically integrated
manufacturing strategy in power semiconductors. Through such vertical
alliances platform, we will offer the most complete, flexible, and customer
oriented 'one-stop' and value-added services and solutions to our customers."
About ASE Group
The ASE Group is the world's largest provider of independent semiconductor
manufacturing services in assembly and test. As a global leader geared
towards meeting the industry's ever growing needs for faster, smaller and
higher performance chips, the Group develops and offers a wide portfolio of
technology and solutions including IC test program design, front-end
engineering test, wafer probe, wafer bump, substrate design and supply, wafer
level package, flip chip, system-in-package and final test. ASE Group also
provides electronic manufacturing services through its affiliate, Universal
Scientific Industrial Co Ltd. The Group generated sales revenues of $3
billion in 2008 and employs over 25,000 people worldwide. For more
information about the ASE Group, visit http://www.aseglobal.com .
About AMPI
AMPI (TAIEX: 6287) is a leader in wafer foundry service for power
semiconductors such as power MOSFET's, IGBT's, power diodes, and power IC's.
Through close partnerships with its customers, AMPI has developed a broad
range of cutting-edge customer-specific process technologies that enable
customers' device designs for applications in computing, consumer electronics,
display, lighting, automotives, energy, communications and industrial segments.
Hon Hai, the world's largest EMS provider, and Advanced Power Electronics Corp.
(APEC), Taiwan's leading power semiconductor design house, are both major
shareholders of AMPI. AMPI is located in Hsin-chu Science Park, Taiwan. For
more information about AMPI, visit http://www.ampi.com.tw .
Safe Harbor Notice:
This press release contains "forward-looking statements" within the
meaning of Section 27A of the United States Securities Act of 1933, as amended,
and Section 21E of the United States Securities Exchange Act of 1934, as
amended, including statements regarding our future results of operations and
business prospects. Although these forward-looking statements, which may
include statements regarding our future results of operations, financial
condition or business prospects, are based on our own information and
information from other sources we believe to be reliable, you should not place
undue reliance on these forward-looking statements, which apply only as of the
date of this press release. The words "anticipate", "believe", "estimate",
"expect", "intend", "plan" and similar expressions, as they relate to us, are
intended to identify these forward-looking statements in this press release.
Our actual results of operations, financial condition or business prospects
may differ materially from those expressed or implied in these forward-looking
statements for a variety of reasons, including risks associated with
cyclicality and market conditions in the semiconductor industry; demand for
the outsourced semiconductor packaging and testing services we offer and for
such outsourced services generally; the highly competitive semiconductor
industry; our ability to introduce new packaging, interconnect materials and
testing technologies in order to remain competitive; our ability to
successfully integrate pending and future mergers and acquisitions;
international business activities; our business strategy; general economic and
political conditions, including the recent global financial crisis; possible
disruptions in commercial activities caused by natural or human-induced
disasters; our future expansion plans and capital expenditures; the strained
relationship between the Republic of China and the People's Republic of China;
fluctuations in foreign currency exchange rates; and other factors. For a
discussion of these risks and other factors, please see the documents we file
from time to time with the Securities and Exchange Commission, including our
2007 Annual Report on Form 20-F filed on June 30, 2008.
Contact:
ASE Group
Freddie Liu, Vice President
Allen Kan, Manager
Tel: +886-2-8780-5489
http://www.aseglobal.com
AMPI
Samy Fan, Finance Director
Daniel Peng, Manager
Tel: +886-3577-0033
http://www.ampi.com.tw
